 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| a SUMMARY Preliminary Technical Data High performance 32-bit/40-bit floating point processor optimized for high performance audio processing Single-instruction, multiple-data (SIMD) computational architecture On-chip memory--0.5M bit of on-chip SRAM and a dedicated 2M bit of on-chip mask-programmable ROM Code compatible with all other members of the SHARC family The ADSP-21375 is available with a 266 MHz core instruction rate with unique audio centric peripherals such as the digital applications interface, serial ports, precision clock generators and more. For complete ordering information, see Ordering Guide on Page 42 SHARC(R) Processor ADSP-21375 CORE PRO CESSOR INSTRUCTIO N CACHE 32 X 48-BIT 4 BLOCKS O F ON-CHIP MEMORY 0. 5M BIT RAM, 2M BIT ROM JTAG T EST & EMULATION TIMER DAG 1 8X4X32 DAG2 8X4X32 PROGRAM SE QUENCER ADDR 32 DATA 64 FLAGS4-15 16 EXTERNAL PORT P M A D D RE SS BU S DM A DD R ES S B U S 32 32 PM DA TA B U S 64 SDRAM CO NTRO LLER ASYNCHRONOUS MEMO RY INTERFACE IO A(24) I OD(32) CONTRO L PINS 7 DATA 11 CONTROL 24 ADDRESS 3 D M D A TA B U S 64 PROCESS ING ELEMENT (PEX) PROCESSING ELEMENT (PEY) PX REGISTER IOP REGISTER (MEMORY MAPPED) CONTRO L, STATUS, & DATA BUFFERS DMA CONTROLLER (24 CHANNELS ) MEMO RY-TO-MEMORY DMA (2) DAI ROUTING UNIT DPI ROUTING UNIT SERIAL PORTS (4) INPUT DATA POR T/ PDAP DAI PINS SPI PORT (2) TWO WIRE INTERFACE DPI PINS 4 GP IO FLAGS/ IRQ/TIMEXP UART (1) PRECISION CLO CK GENERATORS (4) S TIMERS (2) DIGITAL APPLICATIONS INTERFACE 20 DIGITAL PERIP HERAL INTE RFACE 14 I/O PROCESSOR Figure 1. Functional Block Diagram SHARC and the SHARC logo are registered trademarks of Analog Devices, Inc. Rev. PrB Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 (c) 2005 Analog Devices, Inc. All rights reserved. ADSP-21375 KEY FEATURES - PROCESSOR CORE At 266 MHz (3.75 ns) core instruction rate, the ADSP-21375 performs 1.596 GFLOPs/533 MMACs 0.5M bit on-chip, SRAM for simultaneous access by the core processor and DMA 2M bit on-chip, mask-programmable, ROM Dual data address generators (DAGs) with modulo and bitreverse addressing Zero-overhead looping with single-cycle loop setup, providing efficient program sequencing Single instruction multiple data (SIMD) architecture provides: Two computational processing elements Concurrent execution Code compatibility with other SHARC family members at the assembly level Parallelism in buses and computational units allows: Single cycle executions (with or without SIMD) of a multiply operation, an ALU operation, a dual memory read or write, and an instruction fetch Transfers between memory and core at a sustained 4.25G byte/sec bandwidth at 266 MHz core instruction rate Preliminary Technical Data Up to 8 TDM stream support, each with 128 channels per frame Companding selection on a per channel basis in TDM mode Input data port, configurable as eight channels of serial data or seven channels of serial data and up to a 20-bit wide parallel data channel Signal routing unit provides configurable and flexible connections between all DAI/DPI components 2 Muxed Flag/IRQ lines 1 Muxed Flag/Timer expired line /MS pin 1 Muxed Flag/IRQ /MS pin ROM Based Security features include: JTAG access to memory permitted with a 64-bit key Protected memory regions that can be assigned to limit access under program control to sensitive code PLL has a wide variety of software and hardware multiplier/divider ratios Dual voltage: 3.3 V I/O, 1.2 V core Available in 208-lead MQFP Package (see Ordering Guide on Page 42) INPUT/OUTPUT FEATURES DMA controller supports: 24 DMA channels for transfers between ADSP-21375 internal memory and a variety of peripherals 32-bit DMA transfers at peripheral clock speed, in parallel with full-speed processor execution 16-Bit wide external port provides glueless connection to both synchronous (SDRAM) and asynchronous memory devices Programmable wait state options: 2 to 31 SDCLK cycles Delay-line DMA engine maintains circular buffers in external memory with tap/offset based reads SDRAM accesses at 133 MHz and asynchronous accesses at 42.25 MHz 4 memory select lines allows multiple external memory devices Digital applications interface (DAI) includes four serial ports, four precision clock generators, an input data port, and a signal routing unit Digital peripheral interface (DPI) includes, two timers, one UART, and two SPI ports, and a two wire interface port Outputs of PCG's C and D can be driven on to DPI pins Four dual data line serial ports that operate at up to 33M bits/s on each data line -- each has a clock, frame sync and two data lines that can be configured as either a receiver or transmitter pair TDM support for telecommunications interfaces including 128 TDM channel support for newer telephony interfaces such as H.100/H.110 Rev. PrB | Page 2 of 42 | December 2005 Preliminary Technical Data TABLE OF CONTENTS Summary ................................................................1 Key Features - Processor Core ..................................2 Input/Output Features ............................................2 General Description ..................................................4 ADSP-21375 Family Core Architecture .......................4 ADSP-21375 Memory .............................................5 External Memory ...................................................5 ADSP-21375 Input/Output Features ...........................7 System Design .......................................................9 Development Tools ................................................9 Pin Function Descriptions ........................................ 12 Data Modes ........................................................ 15 Boot Modes ........................................................ 15 Core Instruction Rate to CLKIN Ratio Modes ............. 15 ADSP-21375 Specifications ....................................... 16 Recommended Operating Conditions ....................... 16 Electrical Characteristics ........................................ 16 Absolute Maximum Ratings ................................... 17 Maximum Power Dissipation ................................. 17 ESD Sensitivity .................................................... 17 Timing Specifications ........................................... 17 Output Drive Currents .......................................... 39 Test Conditions ................................................... 39 Capacitive Loading ............................................... 39 Thermal Characteristics ........................................ 40 208-Lead MQFP Pinout ............................................ 41 Package Dimensions ................................................ 42 Ordering Guide ...................................................... 42 ADSP-21375 REVISION HISTORY 12/05--Revision changed from PrA to PrB. Modified Figure 1, Functional Block Diagram,..................1 SDRAM bank address example in last paragraph of SDRAM Controller ...............................................................6 Added Two Wire Interface Port (TWI) ..........................9 Added TWI Controller Timing .................................. 37 Rev. PrB | Page 3 of 42 | December 2005 ADSP-21375 GENERAL DESCRIPTION The ADSP-21375 SHARC processor is a members of the SIMD SHARC family of DSPs that feature Analog Devices' Super Harvard Architecture. The ADSP-21375 is source code compatible with the ADSP-2126x, ADSP-2136x, and ADSP-2116x DSPs as well as with first generation ADSP-2106x SHARC processors in SISD (single-instruction, single-data) mode. The ADSP-21375 is a 32-bit/40-bit floating point processors optimized for high performance automotive audio applications with its large onchip SRAM and mask-programmable ROM, multiple internal buses to eliminate I/O bottlenecks, and an innovative digital applications interface (DAI). As shown in the functional block diagram on Page 1, the ADSP-21375 uses two computational units to deliver a significant performance increase over the previous SHARC processors on a range of DSP algorithms. Fabricated in a state-of-the-art, high speed, CMOS process, the ADSP-21375 processor achieves an instruction cycle time of 3.75 ns at 266 MHz. With its SIMD computational hardware, the ADSP-21375 can perform 1.596 GFLOPS running at 266 MHz. Table 1 shows performance benchmarks for the ADSP-21375. Table 1. ADSP-21375 Benchmarks (at 266 MHz) Benchmark Algorithm 1024 Point Complex FFT (Radix 4, with reversal) FIR Filter (per tap)1 IIR Filter (per biquad)1 Matrix Multiply (pipelined) [3x3] x [3x1] [4x4] x [4x1] Divide (y/x) Inverse Square Root 1 Preliminary Technical Data * On-chip mask-programmable ROM (2M bit) * JTAG test access port The block diagram of the ADSP-21375 on Page 1 also illustrates the following architectural features: * DMA controller * Four full duplex serial ports * Digital applications interface that includes four precision clock generators (PCG), an input data port (IDP), four serial ports, eight serial interfaces, a 16-bit parallel input port (PDAP), and a flexible signal routing unit (DAI SRU). * Digital peripheral interface that includes two timers, one UART, two serial peripheral interfaces (SPI), a two wire interface (TWI), and a flexible signal routing unit (DPI SRU). ADSP-21375 FAMILY CORE ARCHITECTURE The ADSP-21375 is code compatible at the assembly level with the ADSP-2136x, ADSP-2126x, ADSP-21160 and ADSP-21161, and with the first generation ADSP-2106x SHARC processors. The ADSP-21375 shares architectural features with the ADSP2126x, ADSP-2136x, and ADSP-2116x SIMD SHARC processors, as detailed in the following sections. Speed (at 266 MHz) 34.5 s 1.88 ns 7.5 ns 16.91 ns 30.07 ns 11.27 ns 16.91 ns SIMD Computational Engine The ADSP-21375 contains two computational processing elements that operate as a single-instruction multiple-data (SIMD) engine. The processing elements are referred to as PEX and PEY and each contains an ALU, multiplier, shifter and register file. PEX is always active, and PEY may be enabled by setting the PEYEN mode bit in the MODE1 register. When this mode is enabled, the same instruction is executed in both processing elements, but each processing element operates on different data. This architecture is efficient at executing math intensive DSP algorithms. Entering SIMD mode also has an effect on the way data is transferred between memory and the processing elements. When in SIMD mode, twice the data bandwidth is required to sustain computational operation in the processing elements. Because of this requirement, entering SIMD mode also doubles the bandwidth between memory and the processing elements. When using the DAGs to transfer data in SIMD mode, two data values are transferred with each access of memory or the register file. Assumes two files in multichannel SIMD mode The ADSP-21375 continues SHARC's industry leading standards of integration for DSPs, combining a high performance 32-bit DSP core with integrated, on-chip system features. The block diagram of the ADSP-21375 on Page 1, illustrates the following architectural features: * Two processing elements, each of which comprises an ALU, multiplier, shifter and data register file * Data address generators (DAG1, DAG2) * Program sequencer with instruction cache * PM and DM buses capable of supporting four 32-bit data transfers between memory and the core at every core processor cycle * Two programmable interval timers with external event counter capabilities * On-chip SRAM (0.5M bit) Independent, Parallel Computation Units Within each processing element is a set of computational units. The computational units consist of an arithmetic/logic unit (ALU), multiplier, and shifter. These units perform all operations in a single cycle. The three units within each processing element are arranged in parallel, maximizing computational throughput. Single multifunction instructions execute parallel ALU and multiplier operations. In SIMD mode, the parallel ALU and multiplier operations occur in both processing ele- Rev. PrB | Page 4 of 42 | December 2005 Preliminary Technical Data ments. These computation units support IEEE 32-bit singleprecision floating-point, 40-bit extended precision floatingpoint, and 32-bit fixed-point data formats. ADSP-21375 On-Chip Memory The ADSP-21375 contains 0.5 megabits of internal RAM and two megabits of internal mask-programmable ROM. Each block can be configured for different combinations of code and data storage (see Table 2 on page 6). Each memory block supports single-cycle, independent accesses by the core processor and I/O processor. The ADSP-21375 memory architecture, in combination with its separate on-chip buses, allow two data transfers from the core and one from the I/O processor, in a single cycle. The ADSP-21375's, SRAM can be configured as a maximum of 16K words of 32-bit data, 32K words of 16-bit data, 10.9K words of 48-bit instructions (or 40-bit data), or combinations of different word sizes up to 0.5 megabits. All of the memory can be accessed as 16-bit, 32-bit, 48-bit, or 64-bit words. A 16-bit floating-point storage format is supported that effectively doubles the amount of data that may be stored on-chip. Conversion between the 32-bit floating-point and 16-bit floating-point formats is performed in a single instruction. While each memory block can store combinations of code and data, accesses are most efficient when one block stores data using the DM bus for transfers, and the other block stores instructions and data using the PM bus for transfers. Using the DM bus and PM buses, with one bus dedicated to each memory block, assures single-cycle execution with two data transfers. In this case, the instruction must be available in the cache. Data Register File A general-purpose data register file is contained in each processing element. The register files transfer data between the computation units and the data buses, and store intermediate results. These 10-port, 32-register (16 primary, 16 secondary) register files, combined with the ADSP-2136x enhanced Harvard architecture, allow unconstrained data flow between computation units and internal memory. The registers in PEX are referred to as R0-R15 and in PEY as S0-S15. Single-Cycle Fetch of Instruction and Four Operands The ADSP-21375 features an enhanced Harvard architecture in which the data memory (DM) bus transfers data and the program memory (PM) bus transfers both instructions and data (see Figure 1 on page 1). With the ADSP-21375's separate program and data memory buses and on-chip instruction cache, the processor can simultaneously fetch four operands (two over each data bus) and one instruction (from the cache), all in a single cycle. Instruction Cache The ADSP-21375 includes an on-chip instruction cache that enables three-bus operation for fetching an instruction and four data values. The cache is selective--only the instructions whose fetches conflict with PM bus data accesses are cached. This cache allows full-speed execution of core, looped operations such as digital filter multiply-accumulates, and FFT butterfly processing. EXTERNAL MEMORY The external port on the ADSP-21375 SHARC provides a high performance, glueless interface to a wide variety of industrystandard memory devices. The 16-bit wide bus may be used to interface to synchronous and/or asynchronous memory devices through the use of it's separate internal memory controllers: the first is an SDRAM controller for connection of industry-standard synchronous DRAM devices and DIMMs (Dual Inline Memory Module), while the second is an asynchronous memory controller intended to interface to a variety of memory devices. Four memory select pins enable up to four separate devices to coexist, supporting any desired combination of synchronous and asynchronous device types. Non SDRAM external memory address space is shown in Table 3. Data Address Generators With Zero-Overhead Hardware Circular Buffer Support The ADSP-21375's two data address generators (DAGs) are used for indirect addressing and implementing circular data buffers in hardware. Circular buffers allow efficient programming of delay lines and other data structures required in digital signal processing, and are commonly used in digital filters and Fourier transforms. The two DAGs of the ADSP-21375 contain sufficient registers to allow the creation of up to 32 circular buffers (16 primary register sets, 16 secondary). The DAGs automatically handle address pointer wraparound, reduce overhead, increase performance, and simplify implementation. Circular buffers can start and end at any memory location. External Memory Execution In the ADSP-21375, the program sequencer can execute code directly from external memory (SRAM, SDRAM). This allows a reduction in internal memory size, thereby reducing the die area. It also allows for faster code development. With external execution, programs run at slower speeds since 48-bit instructions are fetched in parts from a 16-bit external bus coupled with the inherent latency of fetching instructions from SDRAM. Fetching instructions from external memory generally take three core clock cycles per instruction. Flexible Instruction Set The 48-bit instruction word accommodates a variety of parallel operations, for concise programming. For example, the ADSP-21375 can conditionally execute a multiply, an add, and a subtract in both processing elements while branching and fetching up to four 32-bit values from memory--all in a single instruction. ADSP-21375 MEMORY The ADSP-21375 adds the following architectural features to the SIMD SHARC family core. Rev. PrB | Page 5 of 42 | December 2005 ADSP-21375 Table 2. ADSP-21375 Internal Memory Space IOP Registers 0x0000 0000-0x0003 FFFF Long Word (64 bits) BLOCK 0 ROM 0x0004 0000-0x0004 3FFF Reserved 0x0004 4000-0x0004 BFFF BLOCK 0 RAM 0x0004 C000-0x0004C7FF Reserved 0x0004 C800-0x0004 FFFF BLOCK 1 ROM 0x0005 0000-0x0005 3FFF Reserved 0x0005 4000-0x0005 BFFF BLOCK 1 RAM 0x0005 C000-0x0005 C7FF Reserved 0x0005 C8000-0x0005 FFFF BLOCK 2 RAM 0x0006 0000-0x0006 07FF Reserved 0x0006 0800-0x0006 1FFF Reserved 0x0006 2000-0x0006 FFFF BLOCK 3 RAM 0x0007 0000-0x0007 07FF Reserved 0x0007 0800-0x0007 1FFF Reserved 0x0007 2000-0x0007 FFFF Extended Precision Normal or Instruction Word (48 bits) BLOCK 0 ROM 0x0008 0000-0x0008 5554 Reserved 0x0008 5555-0x0008 FFFF BLOCK 0 RAM 0x0009 0000-0x0009 0AAA Reserved 0x0009 0AAB-0x0009 5554 BLOCK 1 ROM 0x000A 0000-0x000A 5554 Reserved 0x000A 5555-0x000A FFFF BLOCK 1 RAM 0x000B 0000-0x000B 0AAA Reserved 0x000B 0AAB-0X000B 5554 BLOCK 2 RAM 0x000C 0000-0x000C 0AAA Reserved 0x000C 0AAB-0x000C 3FFF Reserved 0x000D 4000-0x000D 5554 BLOCK 3 RAM 0x000E 0000-0x000E 0AAA Reserved 0x000E 0AAB-0x000C 3FFF Reserved 0x000F 4000-0x000F 5554 Preliminary Technical Data Normal Word (32 bits) BLOCK 0 ROM 0x0008 0000-0x0008 7FFF Reserved 0x00088000-0x00097FFF BLOCK 0 RAM 0x0009 8000-0x0009 8FFF Reserved 0x0009 9000-0x0009 FFFF BLOCK 1 ROM 0x000A 0000-0x000A 7FFF Reserved 0x000A 8000-0x000B 7FFF BLOCK 1 RAM 0x000B 8000-0x000B 8FFF Reserved 0x000B 9000-0x000B FFFF BLOCK 2 RAM 0X000C 0000 - 0X000C 3FFF Reserved 0x000C 1000-0x000C 1FFF Reserved 0x000C 4000-0x000D FFFF BLOCK 3 RAM 0x000E 0000-0x000E 0FFF Reserved 0x000E 1000-0x000E 3FFF Reserved 0x000E 4000-0x000F FFFF Short Word (16 bits) BLOCK 0 ROM 0x0010 0000-0x0010 FFFF Reserved 0x0011 0000-0x0012 FFFF BLOCK 0 RAM 0x0013 0000-0x0013 1FFF Reserved 0x0013 2000-0x0013 FFFF BLOCK 1 ROM 0x0014 0000-0x0014 FFFF Reserved 0x0015 0000-0x0016 FFFF BLOCK 1 RAM 0x0017 0000-0x0017 1FFF Reserved 0x0017 2000-0x0017 FFFF BLOCK 2 RAM 0x0018 0000-0x0018 1FFF Reserved 0x0018 2000-0x0018 7FFF Reserved 0x0018 8000-0x001B FFFF BLOCK 3 RAM 0x001C 0000-0x001C 1FFF Reserved 0x001C 2000-0x001C 7FFF Reserved 0x001C 8000-0x001F FFFF Table 3. External Memory for Non SDRAM Addresses Size in words 14M 16M 16M 16M SDRAM Controller The SDRAM controller provides an interface to up to four separate banks of industry-standard SDRAM devices or DIMMs, at speeds up to fSCLK. Fully compliant with the SDRAM standard, each bank can has it's own memory select line (MS0-MS3), and can be configured to contain between 16M bytes and 128M bytes of memory. SDRAM external memory address space is shown in Table 4. The controller maintains all of the banks as a contiguous address space so that the processor sees this as a single address space, even if different size devices are used in the different banks. A set of programmable timing parameters is available to configure the SDRAM banks to support slower memory devices. The memory banks can be configured as 16 bits wide. Bank Bank 0 Bank 1 Bank 2 Bank 3 Address Range 0x0020 0000 - 0x00FF FFFF 0x0400 0000 - 0x04FF FFFF 0x0800 0000 - 0x08FF FFFF 0x0C00 0000 - 0x0CFF FFFF Rev. PrB | Page 6 of 42 | December 2005 Preliminary Technical Data The SDRAM controller address, data, clock, and command pins can drive loads up to 30 pF. For larger memory systems, the SDRAM controller external buffer timing should be selected and external buffering should be provided so that the load on the SDRAM controller pins does not exceed 30 pF. Table 4. External Memory for SDRAM Addresses Size in words 62M 64M 64M 64M ADSP-21375 The ADSP-21375 processor also contains a 14 pin digital peripheral interface which controls: * Two general-purpose timers * Two serial peripheral interfaces * One universal asynchronous receiver/transmitter (UART) * An I2C compatible two wire interface DMA Controller Address Range 0x0020 0000 - 0x03FF FFFF 0x0400 0000 - 0x07FF FFFF 0x0800 0000 - 0x0BFF FFFF 0x0C00 0000 - 0x0FFF FFFF Bank Bank 0 Bank 1 Bank 2 Bank 3 Note that the external memory bank addresses shown are for normal word accesses. If 48-bit instructions are placed in any such bank (with two instructions packed into three 32-bit locations), then care must be taken to map data buffers in the same bank. For example, if 2K instructions are placed starting at the bank 0 base address (0x0020 0000), then the data buffers can be placed starting at an address that is offset by 3K words (0x0020 0C00). The ADSP-21375's on-chip DMA controller allows data transfers without processor intervention. The DMA controller operates independently and invisibly to the processor core, allowing DMA operations to occur while the core is simultaneously executing its program instructions. DMA transfers can occur between the ADSP-21375's internal memory and its serial ports, the SPI-compatible (serial peripheral interface) ports, the IDP (input data port), the parallel data acquisition port (PDAP) or the UART. Twenty-four channels of DMA are available on the ADSP-21375--eight via the serial ports, eight via the input data port, two for the UART, two for the SPI interface, two for the external port, and two for memory-to-memory transfers. Programs can be downloaded to the ADSP-21375 using DMA transfers. Other DMA features include interrupt generation upon completion of DMA transfers, and DMA chaining for automatic linked DMA transfers. Delay Line DMA The ADSP-21375 processor provides delay line DMA functionality. This allows processor reads and writes to external Delay Line Buffers (and hence to external memory) with limited core interaction. Asynchronous Controller The asynchronous memory controller provides a configurable interface for up to four separate banks of memory or I/O devices. Each bank can be independently programmed with different timing parameters, enabling connection to a wide variety of memory devices including SRAM, ROM, flash, and EPROM, as well as I/O devices that interface with standard memory control lines. Bank0 occupies a 14.7M word window and banks 1, 2, and 3 occupy a 16M word window in the processor's address space but, if not fully populated, these windows are not made contiguous by the memory controller logic. The banks can also be configured as 8-bit or 16-bit wide buses for ease of interfacing to a range of memories and I/O devices tailored either to high performance or to low cost and power. The asynchronous memory controller is capable of a maximum throughput of 88M bytes/sec using a 44MHz external bus speed. Other features include 8 to 32-bit and 16 to 32-bit packing and unpacking, booting from bank select 1, and support for delay line DMA. Digital Applications Interface (DAI) The digital applications interface (DAI) provides the ability to connect various peripherals to any of the DSPs DAI pins (DAI_P20-1). Programs make these connections using the signal routing unit (SRU), shown in Figure 1. The SRU is a matrix routing unit (or group of multiplexers) that enables the peripherals provided by the DAI to be interconnected under software control. This allows easy use of the DAI associated peripherals for a much wider variety of applications by using a larger set of algorithms than is possible with non configurable signal paths. The DAI also includes four serial ports, four precision clock generators (PCG), and an input data port (IDP). The IDP provides an additional input path to the ADSP-21375 core, configurable as either eight channels of I2S serial data or as seven channels plus a single 20-bit wide synchronous parallel data acquisition port. Each data channel has its own DMA channel that is independent from the ADSP-21375's serial ports. ADSP-21375 INPUT/OUTPUT FEATURES The ADSP-21375 I/O processor provides 24 channels of DMA, as well as an extensive set of peripherals. These include a 20 pin digital applications interface which controls: * Four serial ports * Four precision clock generators * Internal data port/parallel data acquisition port Serial Ports The ADSP-21375 features four synchronous serial ports that provide an inexpensive interface to a wide variety of digital and mixed-signal peripheral devices such as Analog Devices' AD183x family of audio codecs, ADCs, and DACs. The serial | Page 7 of 42 | December 2005 Rev. PrB ADSP-21375 ports are made up of two data lines, a clock and frame sync. The data lines can be programmed to either transmit or receive and each data line has a dedicated DMA channel. Serial ports are enabled via eight programmable and simultaneous receive or transmit pins that support up to 16 transmit or 16 receive channels of audio data when all four SPORTS are enabled, or four full duplex TDM streams of 128 channels per frame. The serial ports operate at a maximum data rate of 50M bits/s. Serial port data can be automatically transferred to and from on-chip memory via dedicated DMA channels. Each of the serial ports can work in conjunction with another serial port to provide TDM support. One SPORT provides two transmit signals while the other SPORT provides the two receive signals. The frame sync and clock are shared. Serial ports operate in five modes: * Standard DSP serial mode * Multichannel (TDM) mode with support for Packed I2S mode * I2S mode * Packed I2S mode * Left-justified sample pair mode Left-justified sample pair mode is a mode where in each frame sync cycle two samples of data are transmitted/received--one sample on the high segment of the frame sync, the other on the low segment of the frame sync. Programs have control over various attributes of this mode. Each of the serial ports supports the left-justified sample pair and I2S protocols (I2S is an industry standard interface commonly used by audio codecs, ADCs and DACs such as the Analog Devices AD183x family), with two data pins, allowing four left-justified sample pair or I2S channels (using two stereo devices) per serial port, with a maximum of up to 32 I2S channels. The serial ports permit little-endian or big-endian transmission formats and word lengths selectable from 3 bits to 32 bits. For the left-justified sample pair and I2S modes, dataword lengths are selectable between 8 bits and 32 bits. Serial ports offer selectable synchronization and transmit modes as well as optional -law or A-law companding selection on a per channel basis. Serial port clocks and frame syncs can be internally or externally generated. The serial ports also contain frame sync error detection logic where the serial ports detect frame syncs that arrive early (for example frame syncs that arrive while the transmission/reception of the previous word is occurring). All the serial ports also share one dedicated error interrupt. Preliminary Technical Data Serial Peripheral (Compatible) Interface The ADSP-21375 SHARC processor contains two serial peripheral interface ports (SPIs). The SPI is an industry standard synchronous serial link, enabling the ADSP-21375 SPI compatible port to communicate with other SPI compatible devices. The SPI consists of two data pins, one device select pin, and one clock pin. It is a full-duplex synchronous serial interface, supporting both master and slave modes. The SPI port can operate in a multimaster environment by interfacing with up to four other SPI compatible devices, either acting as a master or slave device. The ADSP-21375 SPI compatible peripheral implementation also features programmable baud rate and clock phase and polarities. The ADSP-21375 SPI compatible port uses open drain drivers to support a multimaster configuration and to avoid data contention. UART Port The ADSP-21375 processor provides a full-duplex Universal Asynchronous Receiver/Transmitter (UART) port, which is fully compatible with PC-standard UARTs. The UART port provides a simplified UART interface to other peripherals or hosts, supporting full-duplex, DMA-supported, asynchronous transfers of serial data. The UART also has multiprocessor communication capability using 9-bit address detection. This allows it to be used in multidrop networks through the RS-485 data interface standard. The UART port also includes support for 5 to 8 data bits, 1 or 2 stop bits, and none, even, or odd parity. The UART port supports two modes of operation: * PIO (programmed I/O) - The processor sends or receives data by writing or reading I/O-mapped UART registers. The data is double-buffered on both transmit and receive. * DMA (direct memory access) - The DMA controller transfers both transmit and receive data. This reduces the number and frequency of interrupts required to transfer data to and from memory. The UART has two dedicated DMA channels, one for transmit and one for receive. These DMA channels have lower default priority than most DMA channels because of their relatively low service rates. The UART port's baud rate, serial data format, error code generation and status, and interrupts are programmable: * Supporting bit rates ranging from (fSCLK/ 1,048,576) to (fSCLK/16) bits per second. * Supporting data formats from 7 to12 bits per frame. * Both transmit and receive operations can be configured to generate maskable interrupts to the processor. where the 16-bit UART_Divisor comes from the DLH register (most significant 8 bits) and DLL register (least significant 8 bits). In conjunction with the general-purpose timer functions, autobaud detection is supported. Digital Peripheral Interface (DPI) The digital peripheral interface provides connections to two serial peripheral interface ports (SPI), one universal asynchronous receiver-transmitter (UART), 12 flags, a two wire interface (TWI), and two general-purpose timers. Rev. PrB | Page 8 of 42 | December 2005 Preliminary Technical Data Timers The ADSP-21375 has a total of three timers: a core timer that can generate periodic software interrupts and two general purpose timers that can generate periodic interrupts and be independently set to operate in one of three modes: * Pulse waveform generation mode * Pulse width count/capture mode * External event watchdog mode The core timer can be configured to use FLAG3 as a timer expired signal, and each general purpose timer has one bidirectional pin and four registers that implement its mode of operation: a 6-bit configuration register, a 32-bit count register, a 32-bit period register, and a 32-bit pulse width register. A single control and status register enables or disables both general purpose timers independently. ADSP-21375 Power Supplies The ADSP-21375 has separate power supply connections for the internal (VDDINT), and external (VDDEXT) power supplies. The internal supplies must meet the 1.2V requirement. The external supply must meet the 3.3V requirement. All external supply pins must be connected to the same power supply. Target Board JTAG Emulator Connector Analog Devices DSP Tools product line of JTAG emulators uses the IEEE 1149.1 JTAG test access port of the ADSP-21375 processor to monitor and control the target board processor during emulation. Analog Devices DSP Tools product line of JTAG emulators provides emulation at full processor speed, allowing inspection and modification of memory, registers, and processor stacks. The processor's JTAG interface ensures that the emulator will not affect target system loading or timing. For complete information on Analog Devices' SHARC DSP Tools product line of JTAG emulator operation, see the appropriate "Emulator Hardware User's Guide". Two Wire Interface Port (TWI) The TWI is a bi-directional 2-wire, serial bus used to move 8-bit data while maintaining compliance with the I2C bus protocol. The TWI master incorporates the following features: * Simultaneous master and slave operation on multiple device systems with support for multi master data arbitration * Digital filtering and timed event processing * 7 and 10 bit addressing * 100K bits/s and 400K bits/s data rates * Low interrupt rate DEVELOPMENT TOOLS The ADSP-21375 is supported with a complete set of CROSSCORE(R) software and hardware development tools, including Analog Devices emulators and VisualDSP++(R) development environment. The same emulator hardware that supports other SHARC processors also fully emulates the ADSP-21375. The VisualDSP++ project management environment lets programmers develop and debug an application. This environment includes an easy to use assembler (which is based on an algebraic syntax), an archiver (librarian/library builder), a linker, a loader, a cycle-accurate instruction-level simulator, a C/C++ compiler, and a C/C++ runtime library that includes DSP and mathematical functions. A key point for these tools is C/C++ code efficiency. The compiler has been developed for efficient translation of C/C++ code to DSP assembly. The SHARC has architectural features that improve the efficiency of compiled C/C++ code. The VisualDSP++ debugger has a number of important features. Data visualization is enhanced by a plotting package that offers a significant level of flexibility. This graphical representation of user data enables the programmer to quickly determine the performance of an algorithm. As algorithms grow in complexity, this capability can have increasing significance on the designer's development schedule, increasing productivity. Statistical profiling enables the programmer to non intrusively poll the processor as it is running the program. This feature, unique to VisualDSP++, enables the software developer to passively gather important code execution metrics without interrupting the real-time characteristics of the program. Essentially, the developer can identify bottlenecks in software quickly and efficiently. By using the profiler, the programmer can focus on those areas in the program that impact performance and take corrective action. ROM Based Security The ADSP-21375 has a ROM security feature that provides hardware support for securing user software code by preventing unauthorized reading from the internal code when enabled. When using this feature, the processor does not boot-load any external code, executing exclusively from internal SRAM/ROM. Additionally, the processor is not freely accessible via the JTAG port. Instead, a unique 64-bit key, which must be scanned in through the JTAG or Test Access Port will be assigned to each customer. The device will ignore a wrong key. Emulation features and external boot modes are only available after the correct key is scanned. SYSTEM DESIGN The following sections provide an introduction to system design options and power supply issues. Program Booting The internal memory of the ADSP-21375 boots at system power-up from an 8-bit EPROM via the external port, an SPI master, an SPI slave. Booting is determined by the boot configuration (BOOTCFG1-0) pins (see Table 7 on page 15). Selection of the boot source is controlled via the SPI as either a master or slave device, or it can immediately begin executing from ROM. Rev. PrB | Page 9 of 42 | December 2005 ADSP-21375 Debugging both C/C++ and assembly programs with the VisualDSP++ debugger, programmers can: * View mixed C/C++ and assembly code (interleaved source and object information) * Insert breakpoints * Set conditional breakpoints on registers, memory, and stacks * Trace instruction execution * Perform linear or statistical profiling of program execution * Fill, dump, and graphically plot the contents of memory * Perform source level debugging * Create custom debugger windows The VisualDSP++ IDDE lets programmers define and manage DSP software development. Its dialog boxes and property pages let programmers configure and manage all of the SHARC development tools, including the color syntax highlighting in the VisualDSP++ editor. This capability permits programmers to: * Control how the development tools process inputs and generate outputs * Maintain a one-to-one correspondence with the tool's command line switches The VisualDSP++ Kernel (VDK) incorporates scheduling and resource management tailored specifically to address the memory and timing constraints of DSP programming. These capabilities enable engineers to develop code more effectively, eliminating the need to start from the very beginning, when developing new application code. The VDK features include Threads, Critical and Unscheduled regions, Semaphores, Events, and Device flags. The VDK also supports Priority-based, Preemptive, Cooperative, and Time-Sliced scheduling approaches. In addition, the VDK was designed to be scalable. If the application does not use a specific feature, the support code for that feature is excluded from the target system. Because the VDK is a library, a developer can decide whether to use it or not. The VDK is integrated into the VisualDSP++ development environment, but can also be used via standard command line tools. When the VDK is used, the development environment assists the developer with many error-prone tasks and assists in managing system resources, automating the generation of various VDK based objects, and visualizing the system state, when debugging an application that uses the VDK. VisualDSP++ Component Software Engineering (VCSE) is Analog Devices' technology for creating, using, and reusing software components (independent modules of substantial functionality) to quickly and reliably assemble software applications. Download components from the Web and drop them into the application. Publish component archives from within VisualDSP++. VCSE supports component implementation in C/C++ or assembly language. Use the Expert Linker to visually manipulate the placement of code and data on the embedded system. View memory utilization in a color-coded graphical form, easily move code and data to different areas of the processor or external memory with the Preliminary Technical Data drag of the mouse, examine run time stack and heap usage. The Expert Linker is fully compatible with the existing Linker Definition File (LDF), allowing the developer to move between the graphical and textual environments. In addition to the software and hardware development tools available from Analog Devices, third parties provide a wide range of tools supporting the SHARC processor family. Hardware tools include SHARC processor PC plug-in cards. Third party software tools include DSP libraries, real-time operating systems, and block diagram design tools. Designing an Emulator-Compatible DSP Board (Target) The Analog Devices family of emulators are tools that every DSP developer needs to test and debug hardware and software systems. Analog Devices has supplied an IEEE 1149.1 JTAG Test Access Port (TAP) on each JTAG DSP. Nonintrusive incircuit emulation is assured by the use of the processor's JTAG interface--the emulator does not affect target system loading or timing. The emulator uses the TAP to access the internal features of the processor, allowing the developer to load code, set breakpoints, observe variables, observe memory, and examine registers. The processor must be halted to send data and commands, but once an operation has been completed by the emulator, the DSP system is set running at full speed with no impact on system timing. To use these emulators, the target board must include a header that connects the DSP's JTAG port to the emulator. For details on target board design issues including mechanical layout, single processor connections, signal buffering, signal termination, and emulator pod logic, see the EE-68: Analog Devices JTAG Emulation Technical Reference on the Analog Devices website (www.analog.com)--use site search on "EE-68." This document is updated regularly to keep pace with improvements to emulator support. Evaluation Kit Analog Devices offers a range of EZ-KIT Lite evaluation platforms to use as a cost effective method to learn more about developing or prototyping applications with Analog Devices processors, platforms, and software tools. Each EZ-KIT Lite includes an evaluation board along with an evaluation suite of the VisualDSP++ development and debugging environment with the C/C++ compiler, assembler, and linker. Also included are sample application programs, power supply, and a USB cable. All evaluation versions of the software tools are limited for use only with the EZ-KIT Lite product. The USB controller on the EZ-KIT Lite board connects the board to the USB port of the user's PC, enabling the VisualDSP++ evaluation suite to emulate the on-board processor in-circuit. This permits the customer to download, execute, and debug programs for the EZ-KIT Lite system. It also allows in-circuit programming of the on-board Flash device to store user-specific boot code, enabling the board to run as a standalone unit without being connected to the PC. Rev. PrB | Page 10 of 42 | December 2005 Preliminary Technical Data With a full version of VisualDSP++ installed (sold separately), engineers can develop software for the EZ-KIT Lite or any custom defined system. Connecting one of Analog Devices JTAG emulators to the EZ-KIT Lite board enables high-speed, nonintrusive emulation. ADSP-21375 ADDITIONAL INFORMATION This data sheet provides a general overview of the ADSP-21375 architecture and functionality. For detailed information on the ADSP-2137x Family core architecture and instruction set, refer to the ADSP-2136x SHARC Processor Programming Reference. Rev. PrB | Page 11 of 42 | December 2005 ADSP-21375 PIN FUNCTION DESCRIPTIONS The following symbols appear in the Type column of Table 5: A = asynchronous, G = ground, I = input, O = output, P = power Supply, S = synchronous, (A/D) = active drive, (O/D) = open drain, and T = three-state, (pd) = pull-down resistor, (pu) = pull-up resistor. Table 5. Pin List State During and After Reset Three state with pull-up enabled, driven low Three-state with pull-up enabled Preliminary Technical Data Name ADDR23-0 Type I/O with programmable pu1 Description External Address. The ADSP-21375 outputs addresses for external memory and peripherals on these pins. DATA15-0 I/O with programmable pu External Data. The data pins can be multiplexed to support the external memory interface data (I/O), the PDAP (I), and FLAGS (I/O). After reset, all DATA pins are in EMIF mode and FLAG(0-3) pins will be in FLAGS mode (default). When configured in the IDP_PDAP_CTL register, IDP channel 0 scans the DATA15-8 pins for parallel input data. Digital Applications Interface Pins. These pins provide the physical interface to the DAI SRU. The DAI SRU configuration registers define the combination of on-chip audio centric peripheral inputs or outputs connected to the pin and to the pin's output enable. The configuration registers of these peripherals then determines the exact behavior of the pin. Any input or output signal present in the DAI SRU may be routed to any of these pins. The DAI SRU provides the connection from the serial ports (4), the input data ports (2), and the precision clock generators (4), to the DAI_P20-1 pins. Digital Peripheral Interface. These pins provide the physical interface to the DPI SRU. The DPI SRU configuration registers define the combination of on-chip peripheral inputs or outputs connected to the pin and to the pin's output enable. The configuration registers of these peripherals then determines the exact behavior of the pin. Any input or output signal present in the DPI SRU may be routed to any of these pins. The DPI SRU provides the connection from the timers (2), SPIs (2), UART (1), flags (12) , and generalpurpose I/O (9) to the DPI_P14-1 pins. Memory Acknowledge. External devices can deassert ACK (low) to add wait states to an external memory access. ACK is used by I/O devices, memory controllers, or other peripherals to hold off completion of an external memory access. DAI _P20-1 I/O with programmable pu2 Three-state with programmable pull-up DPI _P14-1 I/O with programmable pu2 Three-state with programmable pull-up ACK Input with programmable pu1 Output with programmable pu1 Output with pu1 Output with pu1 Output with pu1 Output with pu1 Pull-up, driven high Pull-up, driven high Pull-up, driven high Pull-up, driven high Pull-up, driven high RD WR SDRAS SDCAS SDWE External Port Read Enable. RD is asserted whenever the ADSP-21375 reads a word from external memory. RD has a 22.5 k internal pull-up resistor. External Port Write Enable. WR is asserted when the ADSP-21375 writes a word to external memory. WR has a 22.5 k internal pull-up resistor. SDRAM Row Address Strobe. Connect to SDRAM's RAS pin. In conjunction with other SDRAM command pins, defines the operation for the SDRAM to perform. SDRAM Column Address Select. Connect to SDRAM's CAS pin. In conjunction with other SDRAM command pins, defines the operation for the SDRAM to perform. SDRAM Write Enable. Connect to SDRAM's WE or W buffer pin. Rev. PrB | Page 12 of 42 | December 2005 Preliminary Technical Data Table 5. Pin List State During and After Reset Pull-up, driven high Pull-up, driven high ADSP-21375 Name SDCKE SDA10 Type Output with pu1 Output with pu1 Description SDRAM Clock Enable. Connect to SDRAM's CKE pin. Enables and disables the CLK signal. For details, see the data sheet supplied with the SDRAM device. SDRAM A10 Pin. Enables applications to refresh an SDRAM in parallel with a nonSDRAM accesses. This pin replaces the DSP's A10 pin only during SDRAM accesses. SDRAM Clock Output 0. Memory Select Lines 0-1. These lines are asserted (low) as chip selects for the corresponding banks of external memory. The MS3-0 lines are decoded memory address lines that change at the same time as the other address lines. When no external memory access is occurring the MS3-0lines are inactive; they are active however when a conditional memory access instruction is executed, whether or not the condition is true. The MS1 pin can be used in EPORT/FLASH boot mode. See the hardware reference for more information. FLAG0/Interrupt Request0. FLAG1/Interrupt Request1. FLAG2/Interrupt Request/Memory Select2. SDCLK0 MS0-1 O I/O with programmable pu1 FLAG[0]/IRQ0 FLAG[1]/IRQ1 FLAG[2]/IRQ2/ MS2 FLAG[3]/TIMEXP/ MS3 TDI TDO TMS TCK TRST I/O I/O I/O with programmable1 pu (for MS mode) I/O with programmable1 pu (for MS mode) Input with pu Output Input with pu Input Input with pu FLAG3/Timer Expired/Memory Select3. Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a 22.5 k internal pull-up resistor. Test Data Output (JTAG). Serial scan output of the boundary scan path. Test Mode Select (JTAG). Used to control the test state machine. TMS has a 22.5 k internal pull-up resistor. Test Clock (JTAG). Provides a clock for JTAG boundary scan. TCK must be asserted (pulsed low) after power-up or held low for proper operation of the ADSP-21375. Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low) after power-up or held low for proper operation of the ADSP-21375. TRST has a 22.5 k internal pull-up resistor. Emulation Status. Must be connected to the ADSP-21375 Analog Devices DSP Tools product line of JTAG emulators target board connector only. EMU has a 22.5 k internal pull-up resistor. Core/CLKIN Ratio Control. These pins set the start up clock frequency. See Table 8 for a description of the clock configuration modes. Note that the operating frequency can be changed by programming the PLL multiplier and divider in the PMCTL register at any time after the core comes out of reset. Boot Configuration Select. These pins select the boot mode for the processor. The BOOTCFG pins must be valid before reset is asserted. See Table 7 for a description of the boot modes. EMU Output with pu CLK_CFG1-0 Input BOOT_CFG1-0 Input Rev. PrB | Page 13 of 42 | December 2005 ADSP-21375 Table 5. Pin List State During and After Reset Preliminary Technical Data Name RESET Type Input Description Processor Reset. Resets the ADSP-21375 to a known state. Upon deassertion, there is a 4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins program execution from the hardware reset vector address. The RESET input must be asserted (low) at power-up. Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external crystal. Local Clock In. Used in conjunction with XTAL. CLKIN is the ADSP-21375 clock input. It configures the ADSP-21375 to use either its internal clock generator or an external clock source. Connecting the necessary components to CLKIN and XTAL enables the internal clock generator. Connecting the external clock to CLKIN while leaving XTAL unconnected configures the ADSP-21375 to use the external clock source such as an external clock oscillator. CLKIN may not be halted, changed, or operated below the specified frequency. Local Clock Out. CLKOUT can also be configured as a reset out pin.The functionality can be switched between the PLL output clock and reset out by setting bit 12 of the PMCTREG register. The default is reset out. XTAL CLKIN Output Input CLKOUT Output 1 2 Pull-up is always enabled Pull-up can be enabled/disabled, value of pull-up cannot be programmed. Rev. PrB | Page 14 of 42 | December 2005 Preliminary Technical Data DATA MODES The upper 32 data pins of the external memory interface are muxed (using bits in the SYSCTL register) to support the external memory interface data (input/output), the PDAP (input only), and the FLAGS (input/output). Table 6 provides the pin settings. Table 6. Function of Data Pins DATA PIN MODE 000 001 010 011 100 101 110 111 DATA15-8 DATA7-0 EPDATA15-0 EPDATA15-0 FLAGS15-8 EPDATA7-0 FLAGS15-0 EPDATA7-0 FLAGS7-0 Reserved Three-state all pins ADSP-21375 BOOT MODES Table 7. Boot Mode Selection BOOTCFG1-0 00 01 10 11 Booting Mode SPI Slave Boot SPI Master Boot EPROM/FLASH Boot Reserved CORE INSTRUCTION RATE TO CLKIN RATIO MODES For details on processor timing, see Timing Specifications and Figure 2 on Page 18. Table 8. Core Instruction Rate/ CLKIN Ratio Selection CLKCFG1-0 00 01 10 11 Core to CLKIN Ratio 6:1 32:1 16:1 Reserved Rev. PrB | Page 15 of 42 | December 2005 ADSP-21375 ADSP-21375 SPECIFICATIONS RECOMMENDED OPERATING CONDITIONS Preliminary Technical Data K Grade Parameter1 VDDINT VDDEXT VIH VIL 2 Min Internal (Core) Supply Voltage External (I/O) Supply Voltage High Level Input Voltage @ VDDEXT = max Low Level Input Voltage @ VDDEXT = min High Level Input Voltage @ VDDEXT = max Low Level Input Voltage @ VDDEXT = min Ambient Operating Temperature 1.14 3.13 2.0 -0.5 1.74 -0.5 0 Max 1.26 3.47 VDDEXT + 0.5 +0.8 VDDEXT + 0.5 +1.19 +70 Unit V V V V V V C 3 VIH_CLKIN3 VIL_CLKIN TAMB 1 2 4, 5 Specifications subject to change without notice. Applies to input and bidirectional pins: AD23-0, DATA16-0, FLAG3-0, DAI_Px, DPI_Px, SPIDS, BOOTCFGx, CLKCFGx, RESET, TCK, TMS, TDI, TRST. 3 Applies to input pin CLKIN. 4 See Thermal Characteristics on Page 40 for information on thermal specifications. 5 See Engineer-to-Engineer Note (No. TBD) for further information. ELECTRICAL CHARACTERISTICS Parameter1 VOH VOL IIH IIL 4 5 6, 7 2 Test Conditions High Level Output Voltage Low Level Output Voltage High Level Input Current Low Level Input Current Low Level Input Current Pull-up Three-State Leakage Current Three-State Leakage Current @ VDDEXT = min, IOH = -1.0 mA @ VDDEXT = min, IOL = 1.0 mA 3 3 Min 2.4 Max Unit V 2 0.4 10 10 200 10 10 200 500 4.7 V A A A A A A mA pF 4, 5 @ VDDEXT = max, VIN = VDDEXT max @ VDDEXT = max, VIN = 0 V @ VDDEXT = max, VIN = 0 V @ VDDEXT= max, VIN = VDDEXT max @ VDDEXT = max, VIN = 0 V @ VDDEXT = max, VIN = 0 V tCCLK = 5.0 ns, VDDINT = 1.2 fIN = 1 MHz, TCASE = 25C, VIN = 1.3V IILPU IOZH IOZL 6 7 8, 9 IOZLPU Three-State Leakage Current Pull-up Supply Current (Internal) Input Capacitance IDD-INTYP CIN 1 2 10, 11 Specifications subject to change without notice. Applies to output and bidirectional pins: ADDR23-0, DATA16-0, RD, WR, FLAG3-0, DAI_Px, DPI_Px, EMU, TDO, CLKOUT, XTAL. 3 See Output Drive Currents on Page 39 for typical drive current capabilities. 4 Applies to input pins: BOOTCFGx, CLKCFGx, TCK, RESET, CLKIN. 5 Applies to input pins with 22.5 k internal pull-ups: TRST, TMS, TDI. 6 Applies to three-statable pins: FLAG3-0. 7 Applies to three-statable pins with 22.5 k pull-ups: DAI_Px, DPI_Px, EMU. 8 Typical internal current data reflects nominal operating conditions. 9 See Engineer-to-Engineer Note (No. TBD) for further information. 10 Applies to all signal pins. 11 Guaranteed, but not tested. Rev. PrB | Page 16 of 42 | December 2005 Preliminary Technical Data ABSOLUTE MAXIMUM RATINGS Parameter Internal (Core) Supply Voltage (VDDINT)1 External (I/O) Supply Voltage (VDDEXT)1 Input Voltage -0.5 V to VDDEXT1 Output Voltage Swing -0.5 V to VDDEXT1 Load Capacitance1 Storage Temperature Range1 Junction Temperature under Bias 1 ADSP-21375 Rating -0.3 V to +1.5 V -0.3 V to +4.6 V +0.5 V +0.5 V 200 pF -65C to +150C 125C Stresses greater than those listed above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. MAXIMUM POWER DISSIPATION The data in this table is based on theta JA (JA) established per JEDEC standards JESD51-2 and JESD51-6. See Engineer-toEngineer note (EE-TBD) for further information. For information on package thermal specifications, see Thermal Characteristics on Page 40. Max Ambient Temp1 70C 1 208 MQFP TBD W Power Dissipation greater than that listed above may cause permanent damage to the device. For more information, see Thermal Characteristics on page 40. ESD SENSITIVITY CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADSP-21375 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. TIMING SPECIFICATIONS The ADSP-21375's internal clock (a multiple of CLKIN) provides the clock signal for timing internal memory, processor core, and serial ports. During reset, program the ratio between the processor's internal clock frequency and external (CLKIN) clock frequency with the CLKCFG1-0 pins (see Table 8 on page 15). To determine switching frequencies for the serial ports, divide down the internal clock, using the programmable divider control of each port (DIVx for the serial ports). Rev. PrB | Page 17 of 42 | December 2005 ADSP-21375 Figure 2 shows core to CLKIN ratios of 6:1, 16:1 and 32:1 with external oscillator or crystal. Note that more ratios are possible and can be set through software using the power management control register (PMCTL). For more information, see the ADSP2136x SHARC Processor Programming Reference. Preliminary Technical Data PLLICLK CLKOUT CLKIN XTAL XTAL OSC INDIV /1, 2 PLLM DIVEN /2, 4, 8, 16 CCLK (CORE CLOCK) PCLK, SDCLK (PERIPHERAL CLOCK, SDRAM CLOCK) PRECISION CLOCK GENERATORS CLKCFG [1:0] (6:1, 16:1, 32:1) Figure 2. Core Clock and System Clock Relationship to CLKIN The ADSP-21375's internal clock switches at higher frequencies than the system input clock (CLKIN). To generate the internal clock, the processor uses an internal phase-locked loop (PLL). This PLL-based clocking minimizes the skew between the system clock (CLKIN) signal and the processor's internal clock. Note the definitions of various clock periods shown in Table 10 which are a function of CLKIN and the appropriate ratio control shown in Table 9. Table 9. ADSP-21375 CLKOUT and CCLK Clock Generation Operation Timing Requirements CLKIN CCLK Description Input Clock Core Clock Calculation 1/tCK 1/tCCLK Use the exact timing information given. Do not attempt to derive parameters from the addition or subtraction of others. While addition or subtraction would yield meaningful results for an individual device, the values given in this data sheet reflect statistical variations and worst cases. Consequently, it is not meaningful to add parameters to derive longer times. See Figure 27 on page 39 under Test Conditions for voltage reference levels. Switching Characteristics specify how the processor changes its signals. Circuitry external to the processor must be designed for compatibility with these signal characteristics. Switching characteristics describe what the processor will do in a given circumstance. Use switching characteristics to ensure that any timing requirement of a device connected to the processor (such as memory) is satisfied. Timing Requirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read operation. Timing requirements guarantee that the processor operates correctly with other devices. Table 10. Clock Periods Timing Requirements tCK tCCLK tPCLK tSCLK tSDCLK tSPICLK 1 Description1 CLKIN Clock Period (Processor) Core Clock Period (Peripheral) Clock Period = 2 x tCCLK Serial Port Clock Period = (tPCLK) x SR SDRAM Clock Period = (tCCLK) x SDR SPI Clock Period = (tPCLK) x SPIR where: SR = serial port-to-core clock ratio (wide range, determined by SPORT CLKDIV bits in DIVx register) SPIR = SPI-to-Core Clock Ratio (wide range, determined by SPIBAUD register setting) SPICLK = SPI Clock SDR=SDRAM-to-Core Clock Ratio (Values determined by bits 20-18 of the PMCTL register) Rev. PrB | Page 18 of 42 | December 2005 Preliminary Technical Data Power-Up Sequencing The timing requirements for processor startup are given in Table 11. Table 11. Power Up Sequencing Timing Requirements (Processor Startup) Parameter Timing Requirements tRSTVDD tIVDDEVDD tCLKVDD1 tCLKRST tPLLRST Min RESET Low Before VDDINT/VDDEXT On VDDINT on Before VDDEXT CLKIN Valid After VDDINT/VDDEXT Valid CLKIN Valid Before RESET Deasserted PLL Control Setup Before RESET Deasserted 0 -50 0 102 203 ADSP-21375 Max Unit ns ms ms s s 200 200 Switching Characteristic Core Reset Deasserted After RESET Deasserted tCORERST 1 4096tCK + 2 tCCLK 4, 5 Valid VDDINT/VDDEXT assumes that the supplies are fully ramped to their 1.2 and 3.3 volt rails. Voltage ramp rates can vary from microseconds to hundreds of milliseconds depending on the design of the power supply subsystem. 2 Assumes a stable CLKIN signal, after meeting worst-case startup timing of crystal oscillators. Refer to your crystal oscillator manufacturer's datasheet for startup time. Assume a 25 ms maximum oscillator startup time if using the XTAL pin and internal oscillator circuit in conjunction with an external crystal. 3 Based on CLKIN cycles 4 Applies after the power-up sequence is complete. Subsequent resets require a minimum of four CLKIN cycles for RESET to be held low in order to properly initialize and propagate default states at all I/O pins. 5 The 4096 cycle count depends on tSRST specification in Table 13. If setup time is not met, one additional CLKIN cycle may be added to the core reset time, resulting in 4097 cycles maximum. RESET tRSTVDD VDDINT tIVDDEVDD VDDEXT tCLKVDD CLKIN tCLKRST CLK_CFG1-0 tPLLRST RSTOUT tCORERST Figure 3. Power-Up Sequencing Rev. PrB | Page 19 of 42 | December 2005 ADSP-21375 Clock Input Table 12. Clock Input 266 MHz Min 22.51 91 91 3.751 Preliminary Technical Data Unit Max 3202 1502 1502 TBD 10 ns ns ns ns ns Parameter Timing Requirements tCK CLKIN Period tCKL CLKIN Width Low tCKH CLKIN Width High tCKRF CLKIN Rise/Fall (0.4V-2.0V) tCCLK3 CCLK Period 1 2 Applies only for CLKCFG1-0 = 00 and default values for PLL control bits in PMCTL. Applies only for CLKCFG1-0 = 01 and default values for PLL control bits in PMCTL. 3 Any changes to PLL control bits in the PMCTL register must meet core clock timing specification tCCLK. tCK CLKIN tCKH tCKL Figure 4. Clock Input Clock Signals The ADSP-21375 can use an external clock or a crystal. See the CLKIN pin description in Table 5. The programmer can configure the ADSP-21375 to use its internal clock generator by connecting the necessary components to CLKIN and XTAL. Figure 5 shows the component connections used for a crystal operating in fundamental mode. Note that the clock rate is achieved using a 16.67 MHz crystal and a PLL multiplier ratio 16:1 (CCLK:CLKIN achieves a clock speed of 266 MHz). To achieve the full core clock rate, programs need to configure the multiplier bits in the PMCTL register. ADSP-2137X CLKIN R1 1M * XTAL R2 47 * C1 22pF Y1 16.67 MHz C2 22pF R2 SHOULD BE CHOSEN TO LIMIT CRYSTAL DRIVE POWER. REFER TO CRYSTAL MANUFACTURER'S SPECIFICATIONS *TYPICAL VALUES Figure 5. 266 MHz Operation (Fundamental Mode Crystal) Rev. PrB | Page 20 of 42 | December 2005 Preliminary Technical Data Reset Table 13. Reset Parameter Timing Requirements tWRST1 RESET Pulse Width Low tSRST RESET Setup Before CLKIN Low 1 ADSP-21375 Min 4tCK 8 Max Unit ns ns Applies after the power-up sequence is complete. At power-up, the processor's internal phase-locked loop requires no more than 100 s while RESET is low, assuming stable VDD and CLKIN (not including start-up time of external clock oscillator). CLKIN tWRST RESET tSRST Figure 6. Reset Interrupts The following timing specification applies to the FLAG0, FLAG1, and FLAG2 pins when they are configured as IRQ0, IRQ1, and IRQ2 interrupts. Table 14. Interrupts Parameter Timing Requirement tIPW IRQx Pulse Width Min 2 x tPCLK +2 Max Unit ns DAI_P20-1 DPI_14-1 FLAG2-0 (IRQ2-0) tIPW Figure 7. Interrupts Rev. PrB | Page 21 of 42 | December 2005 ADSP-21375 Core Timer The following timing specification applies to FLAG3 when it is configured as the core timer (CTIMER). Table 15. Core Timer Parameter Switching Characteristic tWCTIM CTIMER Pulse width Min 4 x tPCLK - 1 Preliminary Technical Data Max Unit ns FLAG3 (CTIMER) tWCTIM Figure 8. Core Timer Timer WDTH_CAP Timing The following timing specification applies to timer0, and timer1, and in WDTH_CAP (pulse width count and capture) mode. Timer signals are routed to the DPI_P14-1 pins through the SRU. Therefore, the timing specification provided below is valid at the DPI_P14-1 pins. Table 16. Timer Width Capture Timing Parameter Timing Requirement tPWI Timer Pulse Width Min 2 tPCLK Max 2(231- 1) tPCLK Unit ns tPWI DPI_14-1 (TIMER2-0) Figure 9. Timer Width Capture Timing Rev. PrB | Page 22 of 42 | December 2005 Preliminary Technical Data Pin to Pin Direct Routing (DAI and DPI) For direct pin connections only (for example DAI_PB01_I to DAI_PB02_O). Table 17. DAI Pin to Pin Routing Parameter Timing Requirement tDPIO Delay DAI/DPI Pin Input Valid to DAI Output Valid Min 1.5 Max 10 ADSP-21375 Unit ns DAI_Pn DPI_Pn DAI_pm DPI_Pm tDPIO Figure 10. DAI Pin to Pin Direct Routing Rev. PrB | Page 23 of 42 | December 2005 ADSP-21375 Precision Clock Generator (Direct Pin Routing) This timing is only valid when the SRU is configured such that the precision clock generator (PCG) takes its inputs directly from the DAI pins (via pin buffers) and sends its outputs directly to the DAI pins. For the other cases, where the PCG's Table 18. Precision Clock Generator (Direct Pin Routing) Parameter Timing Requirements tPCGIW Input Clock Period tSTRIG PCG Trigger Setup Before Falling Edge of PCG Input Clock tHTRIG PCG Trigger Hold After Falling Edge of PCG Input Clock Switching Characteristics tDPCGIO PCG Output Clock and Frame Sync Active Edge Delay After PCG Input Clock tDTRIGCLK PCG Output Clock Delay After PCG Trigger tDTRIGFS PCG Frame Sync Delay After PCG Trigger tPCGOW Output Clock Period D = FSxDIV, PH = FSxPHASE. 1 Preliminary Technical Data inputs and outputs are not directly routed to/from DAI pins (via pin buffers) there is no timing data available. All timing parameters and switching characteristics apply to external DAI pins (DAI_P01 - DAI_P20). Min 24 2 2 Max Unit ns ns ns 2.5 2.5 + ((2.5 + D) x tPCGIW) 2.5 + ((2.5 + D - PH) x tPCGIW) 2 x tPCGIW1 10 10 + ((2.5 + D) x tPCGIW) 10 + ((2.5 + D - PH) x tPCGIW) ns ns ns ns Normal mode of operation. tSTRIG DAI_Pn DPI_Pn PCG_TRIGx_I tHTRIG tPCGIW DAI_Pm DPI_Pm PCG_EXTx_I (CLKIN) tDPCGIO DAI_Py DPI_Py PCG_CLKx_O tDTRIGCLK tDPCGIO tPCGOW DAI_Pz DPI_Pz PCG_FSx_O tDTRIGFS Figure 11. Precision Clock Generator (Direct Pin Routing) Rev. PrB | Page 24 of 42 | December 2005 Preliminary Technical Data Flags The timing specifications provided below apply to the FLAG3-0 and DPI_P14-1 pins, and the serial peripheral interface (SPI). See Table 5 for more information on flag use. Table 19. Flags Parameter Timing Requirement FLAG3-0 IN Pulse Width tFIPW Switching Characteristic FLAG3-0 OUT Pulse Width tFOPW Min 2 x tPCLK + 3 Max ADSP-21375 Unit ns 2 x tPCLK - 1 ns DPI_P14-1 (FLAG3-0IN ) (DATA31-0) tFIPW DPI_P14-1 (FLAG3-0OUT ) (DATA31-0) tFOPW Figure 12. Flags Rev. PrB | Page 25 of 42 | December 2005 ADSP-21375 SDRAM Interface Timing (133 MHz SDCLK) Table 20. SDRAM Interface Timing1 Parameter Timing Requirement tSSDAT DATA Setup Before SDCLK tHSDAT DATA Hold After SDCLK Switching Characteristic tSCLK SDCLK Period tSCLKH SDCLK Width High tSCLKL SDCLK Width Low Command, ADDR, Data Delay After SDCLK2 tDCAD tHCAD Command, ADDR, Data Hold After SDCLK2 tDSDAT Data Disable After SDCLK tENSDAT Data Enable After SDCLK 1 2 Preliminary Technical Data Minimum 0.0 1.0 7.5 3.65 3.65 Maximum Unit ns ns ns ns ns ns ns ns ns 4.0 1.5 5.3 2.6 For FCCLK = 133 MHz (SDCK ratio = 1:2). Command pins include: SDCAS, SDRAS, SDWE, MSx, SDA10, and SDCKE. tSCLK SDCLK tSCLKH tSSDAT tHSDAT DATA (IN) tSCLKL tDCAD tENSDAT DATA(OUT) tDSDAT tHCAD tDCAD CMND ADDR (OUT) tHCAD NOTE: COMMAND = S DCAS , S DR AS , S DWE , MS x, SDA10, SDCKE. Figure 13. SDRAM Interface Timing for 133 MHz SDCLK Rev. PrB | Page 26 of 42 | December 2005 Preliminary Technical Data Memory Read - Bus Master Use these specifications for asynchronous interfacing to memories. Note that timing for ACK, DATA, RD, WR, and strobe timing parameters only apply to asynchronous access mode. Table 21. Memory Read - Bus Master Parameter Timing Requirements tDAD Address, Selects Delay to Data Valid1, 2 tDRLD RD Low to Data Valid1 tSDS Data Setup to RD High tHDRH Data Hold from RD High3, 4 tDAAK ACK Delay from Address, Selects2, 5 tDSAK ACK Delay from RD Low4 tHAKC ACK Hold After RD High Min Max W+tSDCLK -5.12 W- 1.5 + tSDCLK 1.79 0 tSDCLK -9.5+ W W- 7.0 0 ADSP-21375 Unit ns ns ns ns ns ns ns Switching Characteristics tDRHA Address Selects Hold After RD High RH + 0.44 tDARL Address Selects to RD Low2 tSDCLK -3.3 tRW RD Pulsewidth W - 0.5 tRWR RD High to WR, RD, Low HI +tSDCLK W = (number of wait states specified in AMICTLx register) x tSDCLK. HI =RHC + IC (RHC = (number of Read Hold Cycles specified in AMICTLx register) x tSDCLK IC = (number of Idle Cycles specified in AMICTLx register) x tSDCLK). H = (number of Hold Cycles specified in AMICTLx register) x tSDCLK. 1 2 ns ns ns ns Data Delay/Setup: System must meet tDAD, tDRLD, or tSDS. The falling edge of MSx, is referenced. 3 Note that timing for ACK, DATA, RD, WR, and strobe timing parameters only apply to asynchronous access mode. 4 Data Hold: User must meet tHDA or tHDRH in asynchronous access mode. See Test Conditions on Page 39 for the calculation of hold times given capacitive and dc loads. 5 ACK Delay/Setup: User must meet tDAAK, or tDSAK, for deassertion of ACK (low). For asynchronous assertion of ACK (high) user must meet tDAAK or tDSAK. tHDA ADDRESS MSx RD tDARL tDRHA tRW tDRLD tDAD DATA tSDS tHDRH tDSAK tDAAK ACK tRWR tHAKC WR Figure 14. Memory Read - Bus Master Rev. PrB | Page 27 of 42 | December 2005 ADSP-21375 Memory Write - Bus Master Use these specifications for asynchronous interfacing to memories. Note that timing for ACK, DATA, RD, WR, and strobe timing parameters only apply to asynchronous access mode. Preliminary Technical Data Table 22. Memory Write - Bus Master Parameter Timing Requirements ACK Delay from Address, Selects1, 2 tDAAK tDSAK ACK Delay from WR Low 1, 3 tHAKC ACK Hold After WR High1 Min Max tSDCLK - 9.7 + W W - 7.1 0 Unit ns ns ns Switching Characteristics tDAWH Address, Selects to WR Deasserted2 tSDCLK - 3.1+ W tDAWL Address, Selects to WR Low2 tSDCLK - 2.7 tWW WR Pulsewidth W - 0.4 tDDWH Data Setup Before WR High tSDCLK - 2.1+ W Address Hold After WR Deasserted H + 0.3 tDWHA tDWHD Data Hold After WR Deasserted H + 0.4 4 tDATRWH Data Disable After WR Deasserted tSDCLK - 1.37+ H tWWR WR High to WR, RD Low tSDCLK - 0.2+ H tDDWR Data Disable Before RD Low 2tSDCLK - 4.11 tWDE WR Low to Data Enabled tSDCLK - 3.5 W = (number of wait states specified in AMICTLx register) x tSDCLK. H = (number of hold cycles specified in AMICTLx register) x tSDCLK. 1 2 tSDCLK + 3.9+ H ns ns ns ns ns ns ns ns ns ns ACK Delay/Setup: System must meet tDAAK, or tDSAK, for deassertion of ACK (low). For asynchronous assertion of ACK (high) user must meet tDAAK or tDSAK. The falling edge of MSx is referenced. 3 Note that timing for ACK, DATA, RD, WR, and strobe timing parameters only applies to asynchronous access mode. 4 See Test Conditions on Page 39 for calculation of hold times given capacitive and dc loads. ADDRESS MSx tDAWH tDAWL WR tDWHA tWW tWWR tWDE tDDWH DATA tDATRWH tDDWR tDSAK tDAAK ACK tDWHD tHAKC RD Figure 15. Memory Write - Bus Master Rev. PrB | Page 28 of 42 | December 2005 Preliminary Technical Data Serial Ports To determine whether communication is possible between two devices at clock speed n, the following specifications must be confirmed: 1) frame sync delay and frame sync setup and hold, 2) data delay and data setup and hold, and 3) SCLK width. Table 23. Serial Ports--External Clock Parameter Timing Requirements tSFSE1 FS Setup Before SCLK (Externally Generated FS in either Transmit or Receive Mode) tHFSE1 FS Hold After SCLK (Externally Generated FS in either Transmit or Receive Mode) 1 tSDRE Receive Data Setup Before Receive SCLK tHDRE1 Receive Data Hold After SCLK tSCLKW SCLK Width tSCLK SCLK Period Switching Characteristics tDFSE2 FS Delay After SCLK (Internally Generated FS in either Transmit or Receive Mode) tHOFSE2 FS Hold After SCLK (Internally Generated FS in either Transmit or Receive Mode) tDDTE2 Transmit Data Delay After Transmit SCLK tHDTE2 Transmit Data Hold After Transmit SCLK 1 2 ADSP-21375 Serial port signals (SCLK, FS, data channel A, data channel B) are routed to the DAI_P20-1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20-1 pins. Min Max Unit 2.5 2.5 2.5 2.5 10 20 ns ns ns ns ns ns 7 2 7 2 ns ns ns ns Referenced to sample edge. Referenced to drive edge. Table 24. Serial Ports--Internal Clock Parameter Timing Requirements tSFSI1 FS Setup Before SCLK (Externally Generated FS in either Transmit or Receive Mode) FS Hold After SCLK tHFSI1 (Externally Generated FS in either Transmit or Receive Mode) 1 tSDRI Receive Data Setup Before SCLK tHDRI1 Receive Data Hold After SCLK Switching Characteristics tDFSI2 FS Delay After SCLK (Internally Generated FS in Transmit Mode) FS Hold After SCLK (Internally Generated FS in Transmit Mode) tHOFSI2 2 tDFSI FS Delay After SCLK (Internally Generated FS in Receive or Mode) tHOFSI2 FS Hold After SCLK (Internally Generated FS in Receive Mode) tDDTI2 Transmit Data Delay After SCLK 2 tHDTI Transmit Data Hold After SCLK tSCLKIW Transmit or Receive SCLK Width 1 2 Min Max Unit 7 2.5 7 2.5 ns ns ns ns 3 -1.0 3 -1.0 3 -1.0 0.5tSCLK - 2 0.5tSCLK + 2 ns ns ns ns ns ns ns Referenced to the sample edge. Referenced to drive edge. Rev. PrB | Page 29 of 42 | December 2005 ADSP-21375 Table 25. Serial Ports--Enable and Three-State Parameter Switching Characteristics tDDTEN1 Data Enable from External Transmit SCLK Data Disable from External Transmit SCLK tDDTTE1 tDDTIN1 Data Enable from Internal Transmit SCLK 1 Preliminary Technical Data Min 2 7 -1 Max Unit ns ns ns Referenced to drive edge. Table 26. Serial Ports--External Late Frame Sync Parameter Min Switching Characteristics tDDTLFSE1 Data Delay from Late External Transmit FS or External Receive FS with MCE = 1, MFD = 0 tDDTENFS1 Data Enable for MCE = 1, MFD = 0 0.5 1 Max Unit 7 ns ns The tDDTLFSE and tDDTENFS parameters apply to Left-justified Sample Pair as well as DSP serial mode, and MCE = 1, MFD = 0. EXTERNAL RECEIVE FS WITH MCE = 1, MFD = 0 DAI_P20-1 (SCLK) DRIVE SAMPLE DRIVE tSFSE/I DAI_P20-1 (FS) tHFSE/I tDDTENFS DAI_P20-1 (DATA CHANNEL A/B) tDDTE/I tHDTE/I 1ST BIT 2ND BIT tDDTLFSE LATE EXTERNAL TRANSMIT FS DRIVE SAMPLE DRIVE DAI_P20-1 (SCLK) tSFSE/I DAI_P20-1 (FS) tHFSE/I tDDTENFS DAI_P20-1 (DATA CHANNEL A/B) tDDTE/I tHDTE/I 1ST BIT 2ND BIT tDDTLFSE NOTE: SERIAL PORT SIGNALS (SCLK, FS, DATA CHANNEL A/B) ARE ROUTED TO THE DAI_P20-1 PINS USING THE SRU. THE TIMING SPECIFICATIONS PROVIDED HERE ARE VALID AT THE DAI_P20-1 PINS. Figure 16. External Late Frame Sync1 1 This figure reflects changes made to support left-justified sample pair mode. Rev. PrB | Page 30 of 42 | December 2005 Preliminary Technical Data DATA RECEIVE--INTERNAL CLOCK DRIVE EDGE SAMPLE EDGE DATA RECEIVE--EXTERNAL CLOCK DRIVE EDGE ADSP-21375 SAMPLE EDGE tSCLKIW DAI_P20-1 (SCLK) DAI_P20-1 (SCLK) tSCLKW tDFSI tHOFSI DAI_P20-1 (FS) tSFSI tHFSI DAI_P20-1 (FS) tDFSE tHOFSE tSFSE tHFSE tSDRI DAI_P20-1 (DATA CHANNEL A/B) tHDRI DAI_P20-1 (DATA CHANNEL A/B) tSDRE tHDRE NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL) OR SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE. DATA TRANSMIT--INTERNAL CLOCK DRIVE EDGE SAMPLE EDGE DATA TRANSMIT--EXTERNAL CLOCK DRIVE EDGE SAMPLE EDGE tSCLKIW DAI_P20-1 (SCLK) DAI_P20-1 (SCLK) tSCLKW tDFSI tHOFSI DAI_P20-1 (FS) tSFSI tHFSI DAI_P20-1 (FS) tDFSE tHOFSE tSFSE tHFSE tHDTI DAI_P20-1 (DATA CHANNEL A/B) tDDTI DAI_P20-1 (DATA CHANNEL A/B) tHDTE tDDTE NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL) OR SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE. DRIVE EDGE DAI_P20-1 SCLK (EXT) SCLK DRIVE EDGE tDDTEN DAI_P20-1 (DATA CHANNEL A/B) DRIVE EDGE tDDTTE DAI_P20-1 SCLK (INT) tDDTIN DAI_P20-1 (DATA CHANNEL A/B) Figure 17. Serial Ports Rev. PrB | Page 31 of 42 | December 2005 ADSP-21375 Input Data Port The timing requirements for the IDP are given in Table 27. IDP signals (SCLK, FS, and SDATA) are routed to the DAI_P20-1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20-1 pins. Table 27. IDP Parameter Timing Requirements tSISFS1 FS Setup Before SCLK Rising Edge 1 tSIHFS FS Hold After SCLK Rising Edge SData Setup Before SCLK Rising Edge tSISD1 tSIHD1 SData Hold After SCLK Rising Edge tIDPCLKW Clock Width tIDPCLK Clock Period 1 Preliminary Technical Data Min 2.5 2.5 2.5 2.5 9 24 Max Unit ns ns ns ns ns ns DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG's input can be either CLKIN or any of the DAI pins. SAMPLE EDGE tIPDCLK DAI_P20-1 (SCLK) tIPDCLKW tSISFS DAI_P20-1 (FS) tSIHFS tSISD DAI_P20-1 (SDATA) tSIHD Figure 18. IDP Master Timing Rev. PrB | Page 32 of 42 | December 2005 Preliminary Technical Data Parallel Data Acquisition Port (PDAP) The timing requirements for the PDAP are provided in Table 28. PDAP is the parallel mode operation of channel 0 of the IDP. Note that the most significant 16 bits of external PDAP Table 28. Parallel Data Acquisition Port (PDAP) Parameter Timing Requirements PDAP_CLKEN Setup Before PDAP_CLK Sample Edge tSPCLKEN1 tHPCLKEN1 PDAP_CLKEN Hold After PDAP_CLK Sample Edge tPDSD1 PDAP_DAT Setup Before SCLK PDAP_CLK Sample Edge 1 tPDHD PDAP_DAT Hold After SCLK PDAP_CLK Sample Edge tPDCLKW Clock Width tPDCLK Clock Period Switching Characteristics tPDHLDD Delay of PDAP Strobe After Last PDAP_CLK Capture Edge for a Word PDAP Strobe Pulse Width tPDSTRB 1 ADSP-21375 data can be provided through the DATA31-16 pins. The remaining 4 bits can only be sourced through DAI_P4-1. The timing below is valid at the DATA16-1 pins. Min 2.5 2.5 2.5 2.5 7 24 Max Unit ns ns ns ns ns ns 2 x tPCLK - 1 2 x tPCLK - 1 ns ns Source pins of DATA are ADDR7-0, DATA7-0, or DAI pins. Source pins for SCLK and FS are: 1) DAI pins, 2) CLKIN through PCG, or 3) DAI pins through PCG. SAMPLE EDGE t PDCLK t PDCLKW DAI_P20-1 (PDAP_CLK) t SPCLKEN DAI_P20-1 (PDAP_CLKEN) t HPCLKEN t PDSD DATA t PDHD DAI_P20-1 (PDAP_STROBE) tPDSTRB t PDHLDD Figure 19. PDAP Timing Rev. PrB | Page 33 of 42 | December 2005 ADSP-21375 SPI Interface--Master The ADSP-21375 contains two SPI ports. The primary has dedicated pins and the secondary is available through the DPI. The timing provided in Table 29 and Table 30 applies to both. Table 29. SPI Interface Protocol -- Master Switching and Timing Specifications Parameter Timing Requirements Data Input Valid To SPICLK Edge (Data Input Set-up Time) tSSPIDM tHSPIDM SPICLK Last Sampling Edge To Data Input Not Valid Switching Characteristics tSPICLKM Serial Clock Cycle tSPICHM Serial Clock High Period tSPICLM Serial Clock Low Period tDDSPIDM SPICLK Edge to Data Out Valid (Data Out Delay Time) tHDSPIDM SPICLK Edge to Data Out Not Valid (Data Out Hold Time) FLAG3-0IN (SPI device select) Low to First SPICLK Edge tSDSCIM tHDSM Last SPICLK Edge to FLAG3-0IN High tSPITDM Sequential Transfer Delay Min 8 2 Preliminary Technical Data Max Unit ns ns 8 x tPCLK 4 x tPCLK 4 x tPCLK - 2 0 2 4 x tPCLK - 2 4 x tPCLK - 1 4 x tPCLK - 1 ns ns ns ns ns ns ns FLAG3-0 (OUTPUT) t SDSCIM SPICLK (CP = 0) (OUTPUT) t SPICHM t SPICLM t SPI CLKM t HDSM t SPIT DM t SPICL M SPICLK (CP = 1) (OUTPUT) t SPICHM t D DSPIDM MOSI (OUTPUT) MSB t HDSPIDM LSB t SSPIDM CPHASE = 1 MISO (INPUT) MSB VALID t SSPIDM t HSPIDM LSB VALID tHSPIDM t DDSPIDM MOSI (OUTPUT) CPHASE = 0 MISO (INPUT) MSB t HDSPIDM LSB t SSPIDM MSB VALID t HSPIDM LSB VALID Figure 20. SPI Master Timing Rev. PrB | Page 34 of 42 | December 2005 Preliminary Technical Data SPI Interface--Slave Table 30. SPI Interface Protocol --Slave Switching and Timing Specifications Parameter Timing Requirements tSPICLKS tSPICHS tSPICLS tSDSCO Min Serial Clock Cycle Serial Clock High Period Serial Clock Low Period SPIDS Assertion to First SPICLK Edge CPHASE = 0 CPHASE = 1 Last SPICLK Edge to SPIDS Not Asserted, CPHASE = 0 Data Input Valid to SPICLK edge (Data Input Set-up Time) SPICLK Last Sampling Edge to Data Input Not Valid SPIDS Deassertion Pulse Width (CPHASE=0) 4 x tPCLK 2 x tPCLK 2 x tPCLK - 2 2 x tPCLK 2 x tPCLK 2 x tPCLK 2 2 2 x tPCLK Max ADSP-21375 Unit ns ns ns ns tHDS tSSPIDS tHSPIDS tSDPPW ns ns ns ns Switching Characteristics tDSOE SPIDS Assertion to Data Out Active tDSDHI SPIDS Deassertion to Data High Impedance tDDSPIDS SPICLK Edge to Data Out Valid (Data Out Delay Time) SPICLK Edge to Data Out Not Valid (Data Out Hold Time) tHDSPIDS tDSOV SPIDS Assertion to Data Out Valid (CPHASE=0) 0 0 2 x tPCLK 4 4 9.4 5 x tPCLK ns ns ns ns ns SPIDS (INPUT) t S P IC H S SPICLK (CP = 0) (INPUT) tSPICLS tSPICLKS tHDS tSDPPW tSDSCO SPICLK (CP = 1) (INPUT) tSPICLS tSPICHS tDSOE tDDSPIDS tDDSPIDS MSB LSB tDSDHI tHDSPIDS MISO (OUTPUT) CPHASE = 1 MOSI (INPUT) tHSPIDS tSSPIDS MSB VALID tSSPIDS LSB VALID tDSOV tD S O E MISO (OUTPUT) CPHASE = 0 MOSI (INPUT) MSB tDDSPIDS tHDSPIDS tDSDHI LSB tSSPIDS MSB VALID LSB VALID tHSPIDS Figure 21. SPI Slave Timing Rev. PrB | Page 35 of 42 | December 2005 ADSP-21375 Universal Asynchronous Receiver-Transmitter (UART) Port--Receive and Transmit Timing Figure 22 describes UART port receive and transmit operations. The maximum baud rate is SCLK/16. As shown in Figure 22 there is some latency between the generation of internal UART interrupts and the external data operations. These latencies are negligible at the data transmission rates for the UART. Table 31. UART Port Parameter Timing Requirement tRXD Incoming Data Pulse Width Switching Characteristic tRXD Incoming Data Pulse Width Min 95 Preliminary Technical Data Max Unit ns 95 ns DPI_P14-1 [CLKOUT] (SAMPLE CLOCK) DPI_P14-1 [RXD] RECEIVE INTERNAL UART RECEIVE INTERRUPT DATA(5-8) STOP UART RECEIVE BIT SET BY DATA STOP; CLEARED BY FIFO READ START DPI_P14-1 [TXD] TRANSMIT INTERNAL UART TRANSMIT INTERRUPT UART TRANSMIT BIT SET BY PROGRAM; CLEARED BY WRITE TO TRANSMIT DATA(5-8) STOP(1-2) Figure 22. UART Port--Receive and Transmit Timing Rev. PrB | Page 36 of 42 | December 2005 Preliminary Technical Data TWI Controller Timing Table 32 and Figure 23 provide timing information for the TWI interface. Input Signals (SCL, SDA) are routed to the DPI_P14-1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DPI_P14-1 pins. Table 32. Characteristics of the SDA and SCL Bus Lines for F/S-Mode TWI Bus Devices1 Parameter fSCL tHDSTA tLOW tHIGH tSUSTA tHDDAT tSUDAT tSUSTO tBUF tSP 1 ADSP-21375 SCL Clock Frequency Hold Time (repeated) START Condition. After this Period, the First Clock Pulse is Generated. LOW Period of the SCL Clock HIGH period of the SCL Clock Set-up time for a repeated START condition Data Hold Time for TWI-bus Devices Data Set-up Time Set-up Time for STOP Condition Bus Free Time Between a STOP and START Condition Pulse Width of Spikes Suppressed By the Input Filter Min 0 4.0 4.7 4.0 4.7 0 250 4.0 4.7 n/a Standard-mode Max 100 Min 0 0.6 1.3 0.6 0.6 0 100 0.6 1.3 0 Fast-mode Max 400 Unit kHz s s s s s ns s s ns n/a 50 All values referred to VIHMIN and VILMAX levels. For more information, see Electrical Characteristics on page 16. DPI_P14-1 SDA tSUDA T tLOW tHDS TA t SP tBUF DPI_P14-1 SCL tHDS TA S tH DDA T tHIGH tSUS TA Sr t SUSTO P S Figure 23. Fast and Standard Mode Timing on the TWI Bus Rev. PrB | Page 37 of 42 | December 2005 ADSP-21375 JTAG Test Access Port and Emulation Table 33. JTAG Test Access Port and Emulation Parameter Timing Requirements tTCK TCK Period tSTAP TDI, TMS Setup Before TCK High tHTAP TDI, TMS Hold After TCK High tSSYS1 System Inputs Setup Before TCK High 1 tHSYS System Inputs Hold After TCK High tTRSTW TRST Pulse Width Switching Characteristics tDTDO TDO Delay from TCK Low 2 System Outputs Delay After TCK Low tDSYS 1 2 Preliminary Technical Data Min tCK 5 6 7 18 4tCK Max Unit ns ns ns ns ns ns 7 tCK / 2 + 7 ns ns System Inputs = AD15-0, SPIDS, CLKCFG1-0, RESET, BOOTCFG1-0, MISO, MOSI, SPICLK, DAI_Px, and FLAG3-0. System Outputs = MISO, MOSI, SPICLK, DAI_Px, AD15-0, RD, WR, FLAG3-0, CLKOUT, EMU, and ALE. tTCK TCK tSTAP TMS TDI tDTDO TDO tSSYS SYSTEM INPUTS tDSYS SYSTEM OUTPUTS tHSYS tHTAP Figure 24. IEEE 1149.1 JTAG Test Access Port Rev. PrB | Page 38 of 42 | December 2005 Preliminary Technical Data OUTPUT DRIVE CURRENTS Figure 25 shows typical I-V characteristics for the output drivers of the ADSP-21375. The curves represent the current drive capability of the output drivers as a function of output voltage. ADSP-21375 CAPACITIVE LOADING Output delays and holds are based on standard capacitive loads: 30 pF on all pins (see Figure 26). Figure 30 shows graphically how output delays and holds vary with load capacitance. The graphs of Figure 28, Figure 29, and Figure 30 may not be linear outside the ranges shown for Typical Output Delay vs. Load Capacitance and Typical Output Rise Time (20%-80%, V=Min) vs. Load Capacitance. TBD TBD Figure 25. ADSP-21375 Typical Drive TEST CONDITIONS The ac signal specifications (timing parameters) appear Table 13 on page 21 through Table 33 on page 38. These include output disable time, output enable time, and capacitive loading. The timing specifications for the SHARC apply for the voltage reference levels in Figure 26. Timing is measured on signals when they cross the 1.5 V level as described in Figure 27. All delays (in nanoseconds) are measured between the point that the first signal reaches 1.5 V and the point that the second signal reaches 1.5 V. Figure 28. Typical Output Rise/Fall Time (20%-80%, VDDEXT = Max) TBD TO OUTPUT PIN 50 1.5V 30pF Figure 29. Typical Output Rise/Fall Time (20%-80%, VDDEXT =Min) Figure 26. Equivalent Device Loading for AC Measurements (Includes All Fixtures) TBD INPUT 1.5V OR OUTPUT 1.5V Figure 27. Voltage Reference Levels for AC Measurements Figure 30. Typical Output Delay or Hold vs. Load Capacitance (at Ambient Temperature) Rev. PrB | Page 39 of 42 | December 2005 ADSP-21375 THERMAL CHARACTERISTICS The ADSP-21375 processor is rated for performance over the temperature range specified in Recommended Operating Conditions on Page 16. Table 34 airflow measurements comply with JEDEC standards JESD51-2 and JESD51-6 and the junction-to-board measurement complies with JESD51-8. Test board design complies with JEDEC standards JESD51-7 (MQFP). The junction-to-case measurement complies with MIL- STD-883. All measurements use a 2S2P JEDEC test board. To determine the junction temperature of the device while on the application PCB, use: T J = T CASE + ( JT x P D ) where: TJ = Junction temperature C TCASE = Case temperature (C) measured at the top center of the package JT = Junction-to-top (of package) characterization parameter is the Typical value from Table 34. PD = Power dissipation (see EE Note #TBD) Values of JA are provided for package comparison and PCB design considerations. JA can be used for a first order approximation of TJ by the equation: T J = T A + ( JA x P D ) where: TA = ambient temperature C Values of JC are provided for package comparison and PCB design considerations when an external heatsink is required. Values of JB are provided for package comparison and PCB design considerations. Note that the thermal characteristics values provided in Table 34 are modeled values. Table 34. Thermal Characteristics for 208-Lead MQFP Parameter JA JMA JMA JC JT JMT JMT Condition Airflow = 0 m/s Airflow = 1 m/s Airflow = 2 m/s Airflow = 0 m/s Airflow = 1 m/s Airflow = 2 m/s Typical TBD TBD TBD TBD TBD TBD TBD Unit C/W C/W C/W C/W C/W C/W C/W Preliminary Technical Data Rev. PrB | Page 40 of 42 | December 2005 Preliminary Technical Data 208-LEAD MQFP PINOUT Table 35. 208-Lead MQFP Pin Assignment (Numerically by Lead Number) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 Signal VDD NC NC GND IOVDD NC NC NC NC GND VDD NC NC NC NC NC NC NC NC NC NC VDD GND VDD GND NC DATA15 DATA14 DATA13 DATA12 IOVDD GND VDD GND DATA11 DATA10 DATA9 DATA8 DATA7 DATA6 IOVDD GND VDD DATA4 Pin No. 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 Signal VDD GND IOVDD ADDR0 ADDR2 ADDR1 ADDR4 ADDR3 ADDR5 GND VDD GND IOVDD ADDR6 ADDR7 ADDR8 ADDR9 ADDR10 GND VDD GND IOVDD ADDR11 ADDR12 ADDR13 GND VDD NC NC GND CLKIN XTAL IOVDD GND VDD ADDR14 GND IOVDD ADDR15 ADDR16 ADDR17 ADDR18 GND IOVDD Pin No. 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 Signal VDD GND IOVDD SDCAS SDRAS SDCKE SDWE WR SDA10 GND IOVDD SDCLKO GND VDD RD ACK FLAG3 FLAG2 FLAG1 FLAG0 DAI20 GND VDD GND IOVDD DAI19 DAI18 DAI17 DAI16 DAI15 DAI14 DAI13 DAI12 VDD IOVDD GND VDD GND DAI11 DAI10 DAI8 DAI9 DAI6 DAI7 Pin No. 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 ADSP-21375 Signal VDD VDD GND VDD VDD VDD TDI TRST TCK GND VDD TMS CLK_CFG0 BOOTCFG0 CLK_CFG1 EMU BOOTCFG1 TDO DAI4 DAI2 DAI3 DAI1 IOVDD GND VDD GND DPI14 DPI13 DPI12 DPI11 DPI10 DPI9 DPI8 DPI7 IOVDD GND VDD GND DPI6 DPI5 DPI4 DPI3 DPI1 DPI2 Rev. PrB | Page 41 of 42 | December 2005 ADSP-21375 Pin No. 45 46 47 48 49 50 51 52 Signal DATA5 DATA2 DATA3 DATA0 DATA1 IOVDD GND VDD Pin No. 97 98 99 100 101 102 103 104 Signal ADDR19 ADDR20 ADDR21 ADDR23 ADDR22 MS1 MS0 VDD Pin No. 149 150 151 152 153 154 155 156 Signal DAI5 IOVDD GND VDD GND VDD GND VDD Preliminary Technical Data Pin No. 201 202 203 204 205 206 207 208 Signal CLKOUT RESET IOVDD GND NC NC NC VDD Table 35. 208-Lead MQFP Pin Assignment (Numerically by Lead Number) (Continued) PACKAGE DIMENSIONS The ADSP-21375 is available in a 208-lead Pb-free MQFP package. 0.75 0.60 0.45 4.10 MAX 208 1 30.85 30.60 SQ 30.35 157 156 PIN 1 INDICATOR SEATING PLANE TOP VIEW (PINS DOWN) 28.20 28.00 SQ 27.80 3.60 3.40 3.20 VIEW A 0.20 0.09 52 53 0.50 BSC 0.08 MAX (LEAD COPLANARITY) (LEAD PITCH) 0.27 0.17 (LEAD WIDTH) 105 104 0.50 0.25 VIEW A ROTATED 90 CCW NOTES: 1. THE ACTUAL POSITION OF EACH LEAD IS WITHIN 0.08 FROM ITS IDEAL POSITION WHEN MEASURED IN THE LATERAL DIRECTION. 2. CENTER DIMENSIONS ARE TYPICAL UNLESS OTHERWISE NOTED. 3. DIMENSIONS ARE IN MILLIMETERS AND COMPLY WITH JEDEC STANDARD MS-029, FA-1. Figure 31. 208-Lead MQFP (S-208-2) ORDERING GUIDE Ambient Temperature Range 0C to +70C Part Number ADSP-21375KSZ-ENG1 1 On-Chip SRAM 0.5M bit ROM 2M bit Operating Voltage Package Description 1.2 INT/3.3 EXT V 208-Lead MQFP, Pb-Free Package Option S-208-2 Z= Pb Free package. (c) 2005 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. PR05842-0-12/05(PrB) Rev. PrB | Page 42 of 42 | December 2005 |
Price & Availability of ADSP-21375
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |